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High Frequency Printed Circuit Board Copper Multilayer PCB With Peelable Soldermask

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Shenzhen Xinchenger Electronic Co.,Ltd

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High Frequency Printed Circuit Board Copper Multilayer PCB With Peelable Soldermask

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Surface finish : Immersion gold

Board THK : 1.8mm

Product name : HF circuit board

Panel : 3*1

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Printed Circuit Board High Frequency Multilayer PCB Copper With Peelable Soldermask

Specification:

Board size: 6*6 cm

Layer: 4

Model: XCEH

Board thickness: 1.8mm

Copper foil: 35UM

Material: Rogers

Parameter:

Annual stock meterial			Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.			1-16
Min board thickness			2 layer 0.2mm
			4 layer 0.4mm
			6 layer 0.6mm
			8 layer 0.8mm
			10 layer 1.0mm
Max panel size			508*610mm
Board thickness tolerance　　T≥0.8mm±8%,T＜0.8mm±5%
Wall hole copper thickness			＞0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)

NPTH aperture tolerance			±0.05mm(2mil)
Hole site deviation			±0.05mm(2mil)
Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			＞1012Ωnormal
Through-hole resistance			＜300Ωnormal

We equipped with advance Processing Equipments and Measurement Techniques, such as: High Pecision CNC Drilling Machines, AOI Tester, German Flying Probe Testers and other advanced equipments, and High Frequency Board manufacturing, Special Impedance Control, Buried & Blind Via manufacturing, Flying Probe Test techniques.

Product Tags:

custom pcb printing

printed circuit board design

High Frequency Printed Circuit Board Copper Multilayer PCB With Peelable Soldermask Images

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